The upper pictures show ring 5 and 7 modules mounted on a petal. The silicon and the front end hybrids have been glued onto the frames at the Uni. Brussels and Uni. Lyon. The electrical connections between sensors and front-end electronics and the module testing were done at the RWTH Aachen, Uni. Hamburg, Uni. Karlsruhe, Uni. Lyon, Uni. of California Santa Barbara (USA), Uni. Strasbourg, and  ETH Zurich. 


Fully qualified modules were than distributed to the petal integration centers (RWTH Aachen, Uni. Brussels, Uni. Karlsruhe,  Uni. Louvain, Uni. Lyon and Uni. Strasbourg) where they were mounted onto the petals.


Technical documentation.

 

CMS TEC Si-Modules

Prof. W. Braunschweig, Dr. St. König, Dr. A. Ostaptchouk, Dr. D. Pandoulas,
W. Karpinski, R. Siedling, Dr. A. Schultz von Dratzig, M. Wlochal


Responsible electrical engineer:  W. Karpinski

Responsible mechanical engineer: M. Wlochal

The design for the 6400 TEC Si-Modules has been developed by our group. The upper pictures show the construction drawings for ring 5 and 7 modules.  10 different module types have been developed. The module frames consist of graphite and carbon fiber material. The frames have been produced at the Uni. Brussels and at the RWTH Aachen.